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Vanessa Smet

Research Engineer II

Vanessa Smet

Dr. Vanesssa Smet oversees the Interconnections & Assembly Program for the 3D Systems Packaging Research Center at Georgia Tech.

Her research spans the areas of power electronics, power integration, high temperature die-attachment, 3d packaging technologies, µbga, thermo-mechanical modeling, finite element analysis, reliability of electronic systems, power & thermal cycling, failure analysis, mechanical engineering, mechanics of micro-scale materials, multi-physics problems, and lead-free solders.