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Yogendra Joshi

Professor, John M. McKenney and Warren D. Shiver Distinguished Chair in Building Mechanical Systems, George W. Woodruff School of Mechanical Engineering and School of Electrical and Computer Engineering

Yogendra Joshi

Professor Yogendra Joshi grew up in the Himalayan foothills and graduated from the Indian Institute of Technology, Kanpur with a B.S. Tech. in Mechanical Engineering in 1979. He joined the group of Professor Benjamin Gebhart for graduate studies at the State University of New York, Buffalo, receiving his M.S. in Mechanical Engineering in 1981 and the Ph.D. in Mechanical Engineering and Applied Mechanics in 1984 from the University of Pennsylvania.

Prior to joining the Georgia Tech faculty in August 2001, Professor Joshi held academic positions at the University of Maryland, College Park from 1993 to 2001, and at the Naval Postgraduate School in Monterey, California from 1986 to 1993. Professor Joshi also worked in the semiconductor assembly industry, from 1984 to 1985, on process thermal model development. Professor Joshi's research involves thermal and fluid flow issues associated with electronic devices, packages and systems. He is the author or co-author of fifty journal articles and numerous conference papers. Professor Joshi is also involved in developing internet based distance learning programs in thermal management of electronics.

Professor Joshi holds a joint appointment at Georgia Tech between the School of Mechanical Engineering and the School of Electrical and Computer Engineering.


Research Areas of Interest:

  • Heat transfer, combustion, and energy systems and micro and nano engineering
  • Thermofluid issues in emerging technologies and microthermal systems

 

Awards and Distinctions: 
  • 2010, IEEE Fellow
  • 2010-2011, Indian Institute of Technology, Kanpur, Distinguished Alumnus Award
  • 2008, IBM Faculty Award recognizing program quality and its importance to industry
  • 2006, Electronics and Photonics Division Outstanding Contributions in Thermal Management Award, American Society of Mechanical Engineers
  • 1996-2001, Journal of Electronic Packaging Associate Technical Editor, American Society of Mechanical Engineers
  • 2000, Fellow, American Society of Mechanical Engineers
  • 1999, Curriculum Innovation Award (with A. Bar-Cohen and S. Bhavnani), American Society of Mechanical Engineers
  • 2009, Institute of Electrical and Electronics Engineers Semi-Therm Significant Contributor Award
  • 2003, American Association for the Advancement of Science Fellow
  • 1992, Naval Postgraduate School Certificate of Recognition for Outstanding Instructional Performance
  • Director, Microelectronics & Emerging Technologies Thermal Laboratory (METTL)
  • Faculty, 3D Systems Packaging Center at Georgia Tech
  • Faculty, Interconnect and Packaging Center at Georgia Tech
  • Faculty, George W. Woodruff School of Mechanical Engineering
  • Faculty, School of Electrical and Computer Engineering

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Contact
404.385.2810
Education:
PhD: 
Mechanical Engineering and Applied Mechanics, the University of Pennsylvania, 1984
Masters: 
Mechanical Engineering, the State University of New York, Buffalo, 1981
Bachelors: 
Mechanical Engineering, Indian Institute of Technology, Kanpur, 1979