Laboratory support courses for Georgia Tech students combine lecture and hands-on fabrication experience. Both undergraduate and graduate students gain valuable real-world relevant experience with advanced tool availability, laboratory, and cleanroom environments.
IEN provides support to Georgia Tech colleges and schools for disciplinary and inter-disciplinary courses in microelectronics devices and microelectronics packaging. These hands-on courses some of which are conducted in world-class prototype cleanroom laboratories offer students the opportunity to experience complete process cycles from design to fabrication.
ECE 4752; Integrated Circuit Fabrication - a course in which students get the opportunity to learn about and experience the manufacturing technologies associated with integrated circuit fabrication. Ultimately the students fabricate basic integrated circuit elements (NMOS, PMOS, capacitors, resistors) as well as more complex CMOS circuits such as ring oscillators, inverters, NAND gates, and NOR gates. The course culminates in the characterization of the fabricated devices and circuits as well as a process design project aimed at improving the existing manufacturing process.
ChBE 4803; The Science and Engineering of Microelectronic Fabrication - an elective class for senior level undergraduates in ChBE (or Chemistry) and graduate students in the chemical sciences interested in semiconductor materials and fabrication. The course presents the fundamentals and applications of materials and processes used in the fabrication of semiconductor devices, including integrated circuits. The chemical and engineering issues associated with the processing of the materials used in the fabrication of microelectronic devices are covered. The course will have five hands-on laboratory experiments which form the basic unit operations used in semiconductor microfabrication.
The course will provide the fundamentals of materials synthesis, chemical and mechanical properties, and chemical reactions. In addition, the sequence of processes used to fabricate metal-oxide semiconductor (MOS) integrated circuits will be presented. The set of exploratory experiments includes silicon dioxide deposition, photolithography, diffusion and semiconductor doping, metallization and silicide formation, and integrated circuit testing.
ECE/ MSE/ ME 6776; Introduction to SOP, 3D ICs, 3D Systems and SOC - a system level and cross-disciplinary microsystems packaging graduate course that introduces advanced systems packaging technology concepts for highly-miniaturized convergent electronic and bio-electronic systems. The course integrates various disciplines, including electrical, chemical, materials, mechanical and bio-engineering, to form the basis of new concepts that include SOP, SIP, 3DICs and 3D systems as well as an introduction to digital, RF, optical and thermal SOP technologies.
ECE/ MSE/ ME 4755; Design-Build-Operate I - an NSF supported senior undergraduate and 1st year graduate course designed to introduce electronics packaging and substrate fabrication processes that includes lectures and hands-on labs in 3D systems packaging, interconnection and substrate design, advanced polymer materials, laser and photo micro-via formation and fine line lithography.
ECE/ MSE/ ME 4754; Design-Build-Operate II - the second course in this NSF supported series focuses on current and next generation electronics packaging technology emphasizing hands-on experiences with electronics manufacturing processes, material systems, testing, and reliability assessment. Basic objectives are to gain a practical and fundamental experience in electronics module assembly, thermo-mechanical reliability, electrical functional test, and thermal management. The course is spread over 12 weeks of intensive hands-on practice.