The SMTA and Chip Scale Review magazine have announced that The Georgia Institute of Technology, School of Electrical and Computer Engineering Professor, Dr. Rao Tummala, will present a keynote lecture at the 2016 International Wafer-Level Packaging Conference (IWLPC), on October 19 in San Jose, CA.
Titled "Promise and Future of Embedding and Fan-Out Technologies,” Prof. Tummala’s speech will touch upon the two types packaging strategies, wafer-level packaging (WLP) with embedded ICs with limited external I/O connections, and fan-out technology (eWLP) that eliminates these I/O limitations. He will also talk about two other alternatives such as panel level fan out with chip-first and chip-last options. This presentation will describe the promise and future of embedding and fan-out technologies in relation to package size, thickness, interconnect length, I'O pitch and production costs.
Prof. Rao Tummala is a Distinguished and Endowed Professor Chair at Georgia Tech. He is well known as an industrial technologist, technology pioneer, and educator. He is the father of LTCC and many System-on-Package Technologies.
Interconnecting Wafer-Level packaging, 3D, and manufacturing, the International Wafer-Level Packaging Conference (IWLPC) has been at the forefront of packaging technology evolution. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. More about the conference here
- Christa Ernst